Company to Demonstrate Wide-Ranging Lineup of Memory and Storage Solutions, Introduce New Series of SSDs for Ultra-Thin Notebook Designs

LAS VEGAS — (BUSINESS WIRE) — January 7, 2019 — This week at CES^® 2019, Toshiba Memory America, Inc. (TMA), the U.S.-based subsidiary of Toshiba Memory Corporation, will be on hand to highlight its BiCS FLASH™ 3D technology – and the role it plays in the company’s latest flash memory, UFS, solid state drive (SSD), and KumoScale™ software products. TMA will also leverage CES as a stage to debut the fourth generation of its single-package ball grid array (BGA) SSD product line: the BG4 series.

This press release features multimedia. View the full release here: https://www.businesswire.com/news/home/20190107005215/en/

Making its public debut at CES, TMA’s BG4 series – a new lineup of ultra-compact, single-package NVMe™ SSDs – places both the flash and controller in one package, bringing flexibility to the design of ultra-thin notebooks, embedded systems and boot storage applications for servers and data centers. The BG4 series leverages TMA’s innovative 96-layer BiCS FLASH.

“Although we have been recognized as the inventor of flash memory and the first to introduce the concept of 3D flash memory, we are not content to simply rest on our laurels,” noted Scott Nelson, senior vice president and general manager of Toshiba Memory America, Inc.’s Memory Business Unit. “We continue to refine and push the technology forward in order to address data storage challenges. This approach has made us one of the world’s largest flash memory suppliers and has enabled us to lead the way forward in the migration from floating gate to 3D and 96-layer BiCS FLASH QLC (quadruple-level-cell). We are also helping to chart the path forward in areas such as virtual reality, automotive infotainment, artificial intelligence, technology, and more.”

Demonstrations are located in Toshiba Memory America’s private demo suite at The Venetian^® Resort (Toscana 3704) from January 8 – 11, and include:

• BG4 series of ultra-compact, single-package NVMe SSDs
• Enterprise, Client and Data Center SSDs
• KumoScale™ software
• Qualcomm^® Snapdragon™ 845 Mobile Development Platform with Toshiba UFS
• Qualcomm Snapdragon 820A Automotive Development Platform with Toshiba UFS

For more information, please visit business.toshiba-memory.com

Notes:

NVMe, NVM Express, and NVMe-oF are trademarks of NVM Express, Inc.
Qualcomm Snapdragon is a trademark of Qualcomm Incorporated.
Qualcomm is a registered trademark of Qualcomm Incorporated.
All company names, product names and service names may be trademarks of their respective companies.

About Toshiba Memory America, Inc.

Toshiba Memory America, Inc. is the U.S.-based subsidiary of Toshiba Memory Corporation, a leading worldwide supplier of flash memory and solid state drives (SSDs). From the invention of flash memory to today’s breakthrough 96-layer BiCS FLASH™ 3D technology, Toshiba continues to lead innovation and move the industry forward. For more information on Toshiba Memory, please visit  business.toshiba-memory.com.

© 2018 Toshiba Memory America, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services, and contact information is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice. Technical and application information contained here is subject to the most recent applicable Toshiba product specifications.

View source version on businesswire.com: https://www.businesswire.com/news/home/20190107005215/en/

---

Contact:

MEDIA CONTACT:
Justine Houston-Brown
Lages & Associates
Tel.: (949) 453-8080
Email Contact

COMPANY CONTACT:
Mia Cool
Toshiba Memory America, Inc.
Tel.: (408) 526-3087
Email Contact