Tiannengbo Optimises Their Latest Mining Chip Using Moortec’s Embedded Temperature Sensor

Plymouth, UK, 3rd September 2018 --  Moortec, providers of complete In-Chip Monitoring PVT Subsystems announced today that Tiannengbo Information Technology have utilised Moortec’s Temperature Sensor IP to optimise performance and increase reliability in their latest mining ASIC.

As a company Tiannengbo’s main focus is on chip and system design, production and sales. The company also specializes in blockchain research and development including digital currency product process, including chip design, embedded software and in the case of this project, circuit design for mining hardware.

Mining any type of crypto-currency is highly intensive in terms of CPU activity and requires ever increasing levels of computing power. This increased power consumption requires more electricity and this leads to much higher levels of heat generation. As a result real time temperature monitoring systems are necessary to allow for power optimization. In-chip embedded temperature sensors help extend device lifetimes and provide protection through the enablement of shutdown schemes, the latter being as a result of rising temperatures from sudden increases in dynamic CPU load profiles. Embedded temperature sensors can also be used to measure the relative rise and fall of temperature in specific areas of the chip.

“We have further optimized system to provide more efficient product to our customer based on stable and accurate temperature sensors from Moortec.” Said Lulu Liu, Design director of Tiannengbo.

Moortec CEO Stephen Crosher said “We are pleased to be able to support innovative companies like Tiannengbo who are pushing the limits in not only the digital imaging space but also circuit design for a number of applications including mining. Tiannengbo understands the importance of monitoring the relative temperature fluctuation in such high performance ASIC technology and we are proud to support their project with our highly accurate, highly featured Embedded Temperature Sensor IP” 

About Tiannengbo Information Technology Co., Ltd.

Beijing Tiannengbo Information Technology Co., Ltd is an innovative high technology company founded in 2012, focusing on chip and system design,production and sales. The Company has very professional technical accumulation and industrialization experience in the image processing, video codec, embedded software, circuit design. Since 2015, the company has been active in blockchain research and development including complete digital currency product process, including chip design, verification, mass production, software, system products, sales, and service. The core employees and leaders of the company who have been employed by Intel, AMD, and other listed companies have rich experience in successful entrepreneurship and management in high technology fields.

 

About Moortec

Established in 2005, Moortec provides compelling embedded subsystem IP solutions for Process, Voltage & Temperature (PVT) monitoring, targeting advanced node CMOS technologies on 40nm, 28nm, 16nm, 12nm and 7nm. Moortec’s in-chip sensing solutions support the semiconductor design community’s demands for increased device reliability and enhanced performance optimisation, enabling schemes such as DVFS, AVS and power management control systems. Moortec provides excellent support for IP application, integration and device test during production. Moortec’s high-performance analog and mixed-signal IP designs are delivered to ASIC and System on Chip (SoC) technologies within the consumer, mobile, automotive, high performance computing and telecommunications sectors.



Contacts: 

Email Contact
+86 10 56252709
www.tiannengbo.com

Ramsay Allen
Email Contact
+44 1752 875133
www.moortec.com

Featured Video
Jobs
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
GIS Specialist for Washington State Department of Natural Resources at Olympia, Washington
Senior Principal Software Engineer for Autodesk at San Francisco, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Equipment Engineer, Raxium for Google at Fremont, California
Principal Engineer for Autodesk at San Francisco, California
Upcoming Events
URISA GIS Leadership Academy at Embassy Suites Fort Worth Downtown 600 Commerce Street Fort Worth, TX - Nov 18 - 22, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise