Bill Bintz, executive vice president, product development, commented, "We're excited to offer a comprehensive solution to our power device manufacturing customers. The Purion Power Series family is uniquely suited to excel at these applications due to its innovative platform that offers the flexibility to handle multiple wafer sizes from 150mm to 300mm as well as various substrates including Si and SiC, along with its precision wafer temperature control technology, all accomplished while delivering the industry's highest throughput and capital efficiency."
John Aldeborgh, executive vice president, customer operations, commented, "Power devices are one of the fastest growing segments in IC manufacturing, due to the robust e-mobility and renewable energy markets. Customer inquiries and demand for Purion products serving this very active market have increased, driving significant opportunity for the Purion Power Series family of products."
About Axcelis:
Axcelis (Nasdaq:
ACLS), headquartered in Beverly, Mass., has been providing innovative, high-productivity solutions for the semiconductor industry for 40 years. Axcelis is dedicated to developing enabling process applications through the design, manufacture and
complete life cycle support of
ion implantation systems, one of the most critical and enabling steps in the IC manufacturing process. Learn more about Axcelis at
www.axcelis.com.
CONTACTS:
Maureen Hart (editorial/media) 978.787.4266
Doug Lawson (investor relations) 978.787.9552
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SOURCE Axcelis Technologies, Inc.
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