Highly Expandable, Integrated Device Meets AEC-Q100 Qualifications
IRVINE, Calif. — (BUSINESS WIRE) — December 12, 2017 — Toshiba America Electronic Components, Inc. ( TAEC), a committed technology leader, today announced a new IC that is compliant with the Bluetooth® Low Energy (LE)[1] core specification 4.2 – including support for a secure connection, LE privacy features and extended packet length. The new TC35679IFTG is designed for use in harsh automotive environments and extended temperature ranges. A mixed-signal device, the TC35679IFTG contains both analog RF and baseband digital parts. This enables it to provide a complete solution in a single, compact, low-profile (40-pin 6mm x 6mm x 1mm) QFN ‘wettable flank’ package with a pin pitch of 0.5mm.
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Toshiba's new TC35679IFTG is highly extendable and designed for use in harsh automotive environments and extended temperature ranges. A mixed-signal device, the TC35679IFTG contains both analog RF and baseband digital parts. (Graphic: Business Wire)
The TC35679 provides Bluetooth Host Control Interface (HCI) functions alongside low energy GATT profile functions (as defined by Bluetooth specifications). The new IC becomes a fully fledged application processor when used in conjunction with external non-volatile memory. It can also be used in combination with an external host processor.
The highly integrated device is based on an ARM® Cortex®-M0 processor and includes a sizeable 384kB of on-board mask ROM to support the Bluetooth baseband process. An additional 192kB of on-board RAM provides support for Bluetooth application programs and data. The TC35679 also contains a 26MHz clock oscillator and a 32.768kHz sleep clock that can be driven by an external oscillator.
The TC35679 is suited to sophisticated systems due to its 17 General Purpose IO (GPIO) lines and multiple communications options (including SPI, I2C and a 921.6kbps, two-channel UART). The GPIO lines offer access to a range of on-chip features including a wake-up interface, four-channel PWM interface, six-channel AD converter and the ability to operate the control interface of an optional external power amplifier for applications requiring a longer reach. On-chip DC-DC converters or LDO circuits adjust the external voltage supply to the required values on-chip.
Designed for compliance with AEC-Q100[2], the low-energy TC35679 is targeted to automotive applications. By providing a wireless connection to sensors, the new IC can be used in remote key systems and other applications requiring cable reduction. The TC35679 facilitates remote connection to diagnostic equipment, creating a Bluetooth ‘soft’ On-Board Diagnostic (OBD) port and eliminating the cost and weight associated with cabling and OBD connectors. Additionally, its wettable flank package supports automatic visual inspection, which is necessary to achieve the high soldering quality required to withstand the vibrations that automotive applications experience.
The TC35679 also accepts the wide range of supply voltages (1.8-3.6V) used in automotive applications, with an operating range of -40˚C to 105˚C for input voltages from 2.7V to 3.6V, and a range of -40˚C to 85˚C for 1.8V to 3.6V input voltages.
For more information on Toshiba’s Bluetooth products visit https://toshiba.semicon-storage.com/ap-en/product/wireless-communication/bluetooth.html
Notes
[1] Low power consumption communication technology
defined in Bluetooth® Ver. 4.2.
[2]
Qualification is expected by the end of the year.
The Bluetooth® word mark and logos are registered trademarks owned by the Bluetooth SIG, Inc. and any use of such marks by Toshiba is under license. Other trademarks and trade names are those of their respective owners.
ARM and Cortex are registered trademarks of ARM Limited (or its subsidiaries) in the EU and/or elsewhere.
About Toshiba America Electronic Components, Inc.
Toshiba America Electronic Components, Inc. is the U.S.-based electronic components business of Toshiba Electronic Devices and Storage Corporation. TAEC offers consumers and businesses a wide variety of innovative hard disk drive (HDD) products plus semiconductor solutions for automotive, industrial, IoT, motion control, telecoms, networking, consumer and white goods applications. The company’s broad portfolio encompasses integrated wireless ICs, power semiconductors, microcontrollers, optical semiconductors, ASICs, ASSPs and discrete devices ranging from diodes to logic ICs. For more company information visit TAEC’s web site at www.toshiba.semicon-storage.com.
©2017 Toshiba America Electronic Components, Inc. All rights reserved. Information in this press release, including product pricing and specifications, content of services and contact information, is current and believed to be accurate on the date of the announcement, but is subject to change without prior notice.
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