BEIJING — (BUSINESS WIRE) — October 9, 2017 — Crossbar, Inc., the ReRAM technology leader, is exhibiting and presenting at the 2017 SMIC Technology Symposium in Beijing on Oct. 12, 2017. Crossbar will present views on the current state of ReRAM technology and targeted applications for both embedded and stand-alone non-volatile memory products. Starting its commercialization phase, Crossbar will demonstrate several ReRAM chips and development tools for high-capacity low-latency storage. Crossbar will also showcase technical demos with ReRAM products showing massive battery energy savings for IoT and wearables applications.
Crossbar will speak at the Symposium:
Who: Sylvain Dubois, vice president of Strategic Marketing
Business Development, Crossbar
What: ReRAM as eNVM of choice
for 40nm and below
When: Oct. 12, 2017, 4 p.m.
Where:
Beijing Tylfull Hotel (3rd floor), West Tucheng Road, Haidian
Area, Beijing
About Crossbar, Inc.
Crossbar is the leader in ReRAM technology, enabling kilobytes to terabytes of always-on data storage to be embedded into any processor, microcontroller, FPGA or as a standalone memory chip. Crossbar ReRAM lets designers rethink the compute/storage paradigm, free from the constraints of traditional flash and DRAM memories. From “persistent memory” that brings data closer to CPU to “cognitive memory” that enables in-memory computing without a host CPU, ReRAM is ushering in a new era of data storage and processing for both edge and cloud computing. For more information, visit crossbar-inc.com.
View source version on businesswire.com: http://www.businesswire.com/news/home/20171009006083/en/
Contact:
Tanis Communications, Inc.
Nicole Conley, +1 650-422-3156
Email Contact