MEDIA ALERT: Credo Demonstrates Single-Lane 112G and 56G PAM4 SerDes IP Solutions at TSMC 2017 OIP Ecosystem Forum

MILPITAS, CA--(Marketwired - September 13, 2017) - Credo Semiconductor, a global innovation leader in Serializer-Deserializer (SerDes) technology, today announced it will demonstrate its full offering of advanced SerDes IP at this week's TSMC Technology Symposium, showcasing single-lane 112G PAM4 SerDes solutions.

The wide range of Credo SerDes IP solutions enables ASIC, ASSP, and SoC designers to meet the power and performance requirements of a variety of TSMC advanced processing nodes and supports emerging IEEE standards including 802.3cd/802.3bs/802.3bm which call out 100GBase-DR1, 400GBase-DR4, and 400GBase-FR4.

WHERE:
TSMC Open Innovation Platform Ecosystem Forum
Santa Clara Convention Center
5001 Great America Parkway
Santa Clara, CA 95054
Booth #907

WHEN:
September 13, 2017
8:00 a.m. - 6:30 p.m.

WHAT:
The TSMC OIP Ecosystem Forum brings together TSMC's design ecosystem companies and our customers to share practical, tested solutions to today's design challenges. Success stories that illustrate TSMC's design ecosystem best practices highlight the event.

About Credo Semiconductor
Credo is a leading provider of high performance, mixed-signal semiconductor solutions for the data center, enterprise networking and high-performance computing markets. Credo's advanced Serializer-Deserializer (SerDes) technology delivers the bandwidth scalability and end-to-end signal integrity for next generation platforms requiring single-lane 25G, 50G, and 100G connectivity. The company makes its SerDes available in the form of Intellectual Property (IP) licensing on the most advanced process nodes and with complementary product families focused on extending reach and multiplexing to higher data rates. Credo is headquartered in Milpitas, California and has offices in Shanghai and Hong Kong. For more information: www.credosemi.com




Press Contact:

Jen Peckham

Email Contact


Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Principal Engineer for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Equipment Engineer, Raxium for Google at Fremont, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise