Inphi Announces M200 Ultra-Low Power 100/200G Coherent Digital Signal Processor for High Density Applications

SANTA CLARA, Calif., Sept. 12, 2017 (GLOBE NEWSWIRE) -- Inphi Corporation (NYSE: IPHI), a leading provider of high-speed data movement interconnects, today announced that the company has started sampling its M200, an ultra-low power, and high-performance Coherent Digital Signal Processor (DSP), supporting 100G and 200G data rates for long haul, metro and data center interconnect applications. Inphi will be showcasing the M200 in its booth #337 at the European Conference on Optical Communication (ECOC), in Gothenburg, Sweden, September 18-20.

M200 is the first offering in Inphi’s 16nm LightSpeed-III™ family of SoC devices, from the company’s ClariPhy acquisition. The LightSpeed-III M200 leverages Inphi’s leadership in DSP and FEC technology, including internal analog expertise and SerDes IP. Inphi’s M200 enables ground breaking performance for CFP-DCO and CFP2-DCO coherent module form factors high density line cards, with CFP2-ACO, or line cards with discrete optics implementations to enable the next era in line card capacity and performance.

“Next generation coherent DSPs like the M200 are key to enabling the high-density, low-power coherent WDM solutions that are critical for driving network expansion in the metro market,” said Heidi Adams, Senior Research Director, Transport Networks at IHS Markit. “200G in particular is emerging as a hot technology for metro data center interconnect applications, and with a 5-year CAGR of +87%, is the sweet spot for growth in the metro.”

“With the sampling of our M200 100/200G Coherent DSP product to customers, Inphi is delivering the industry’s lowest power DSP at market leading OSNR performance, at a time when next generation optical networks are requiring higher capacity solutions for exponential growth,” said Nariman Yousefi, SVP Coherent DSP, Inphi. “Inphi’s M200 Coherent Transceiver will change the way customers build and deploy networking equipment by providing a unique combination of best-in-class performance and power consumption, at market leading integration and economics.”

M200 Differentiators

  • Innovative low power digital and analog design to enable next generation line card density while achieving best-in-class OSNR performance critical for OEMs and operators to efficiently expand network capacities
  • Supports two host SerDes with selectable 10G and 28G NRZ interfaces with 100G client FEC termination to eliminate the need for external gearboxes
  • Integrates next generation client features - FIPS compliant AES256 encryption, Link Layer Discovery Protocol (LLDP) monitoring and complete OTN overhead processing to enable highest density and cost optimized Metro and DCI platforms
  • Offers turn-key reference design with a complete suite of hardware design files and user friendly software to accelerate system integration

Availability
M200 has been sampled to multiple OEMs and module partners with general availability targeted for end of the year.

About Inphi
Inphi Corporation is a leader in high-speed data movement interconnects. We move big data fast, throughout the globe, between data centers, and inside data centers. Inphi's expertise in signal integrity results in reliable data delivery, at high speeds, over a variety of distances. As data volumes ramp exponentially due to video streaming, social media, cloud-based services, and wireless infrastructure, the need for speed has never been greater. That's where we come in. Customers rely on Inphi's solutions to develop and build out the Service Provider and Cloud infrastructures, and data centers of tomorrow. To learn more about Inphi, visit www.inphi.com

Inphi, the Inphi logo and Think fast are registered trademarks of Inphi Corporation. All other trademarks used herein are the property of their respective owners.

Public Relations Contacts:
Kim Markle
Inphi
408-217-7329
Email Contact 

 

Featured Video
Jobs
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Equipment Engineer, Raxium for Google at Fremont, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise