CommSolid integrated a single Cadence® Tensilica® Fusion F1 DSP into its latest CSN130 baseband solution to run an ultra-low-power modem plus smart IoT applications such as voice trigger, audio identification and sensor fusion. The Tensilica solution is easily integrated into system-on-chip (SoC) devices to deliver fast time to market with low risk through pre-verified and pre-certified intellectual property (IP).
"Fast time to market along with proven, tested technology and a flexible modem solution are key to our vision of innovative IoT products like smart wallets, reflector posts or suitcases," said Dr. Matthias Weiss, Managing Director of CommSolid. "We are pleased to collaborate with Cadence in providing leading-edge NB-IoT solutions allowing every sensor to be connected to the internet. The combination of CommSolid's NB-IoT technology and the Fusion F1 DSP by Cadence Tensilica provides a solid basis for revolutionary smart applications."
"As the demand for narrowband communication products increases, customers are looking for low-power, reliable IP solutions that allow them to build differentiated SoCs to address a breadth of applications," said Larry Przywara, group director of marketing, Audio/Voice IP, Cadence. "The aim of the collaboration with CommSolid is to develop customizable NB-IoT IP to accelerate the time to market for semiconductor companies competing in the growing cellular IoT market."
The Tensilica Fusion F1 DSP offers low-energy, high-performance control and signal processing ideally suited for the IoT and wearable markets. This highly configurable DSP is specifically designed to excel at digital signal processing tasks like wake-on voice, voice pre-processing, sensor fusion and narrowband connectivity, as well as traditional control code tasks like communications stacks and RTOSs (real time operating system). All processing workloads are completed with ultra-low energy consumption in a very small footprint. The Fusion F1 DSP is an optimal solution for SoCs targeting smart home, wearable, smart city, medical, headphone and other connectivity products.
Visit Cadence at Mobile World Congress 2017 to see the complete solution. For more information about Cadence at MWC 2017, visit https://www.cadence.com/content/cadence-www/global/en_US/home/company/events/industry-events/mwc-2017.html.
Cadence is a leading provider of intellectual property (IP) for system on chip (SoC) developers. Cadence design IP, verification IP, and Tensilica® processor IP have been used to simplify the design and verification of thousands of SoCs across automotive, mobile, enterprise, internet of things (IoT), and consumer applications. Cadence® IP plays a vital role in the company's overarching system design enablement strategy, which is to provide a comprehensive set of tools, design content, and services for the development of innovative electronic systems.
For more information on the Tensilica Fusion DSP family, visit https://ip.cadence.com/ipportfolio/tensilica-ip/fusion.
About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers and research facilities around the world to serve the global electronics industry. More information about the company, its products and its services is available at
www.cadence.com.
About CommSolid
CommSolid is the cellular IoT IP company serving the established global cellular and emerging IoT markets with solid communication solutions. Leveraging the experience of more than a decade at the forefront of the wireless communication business, the CommSolid team has unique capabilities to design high volume and extremely integrated solutions with optimized performance, size and power consumption.
CommSolid was founded in 2015 and is located in Dresden (Germany), in the heart of Silicon Saxony. For more information visit: www.commsolid.com
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