Ambarella Introduces 8K Ultra HD SoCs for Virtual Reality and Drone Cameras

Ambarella H3 SoC delivers 8K Ultra HD at 30 frames per second and 4K Ultra HD at 120 frames per second

SANTA CLARA, Calif. — (BUSINESS WIRE) — January 5, 2017 — Ambarella, Inc. (NASDAQ: AMBA), a leading developer of low-power, HD and Ultra HD video processing semiconductors, today introduced the H3 System-on-Chip (SoC) for high-end drones and a new generation of video cameras, including 360-degree and virtual reality cameras. The H3 video SoC enables 8K Ultra HD H.264/AVC video at 30 frames per second, as well as multiple video streams with equivalent performance, including 360-degree cameras with dual 4KP60 sensor video capture.

8K videos played on large 8K displays provide a better viewing experience to the end user, as pixels at this resolution are indistinguishable to the human eye at any reasonable distance. The combination of 8K video capture together with Ambarella’s advanced oversampling and image stabilization also enables higher video quality 4K video recording.

“With the introduction of H3 we believe we provide the highest video performance and best image quality solution for high-end drones and multi-sensor video cameras,” said Fermi Wang, president and CEO of Ambarella. “H3 delivers 8Kp30 video performance to match the next generation of displays, such as 8K televisions and high resolution head-mounted displays.”

H3 includes a powerful multi-channel ISP for 360 degree video capture and multi-sensor drone applications. Its 10-bit HEVC High Dynamic Range (HDR) video processing handles high contrast and wide color range scenes. It also features Ambarella’s advanced Electronic Image Stabilization (EIS), capable of generating a smooth 4Kp60 video output under challenging conditions, including during high winds and with high degrees of rotation. The integration of a quad-core ARM® Cortex®-A53 CPU with floating point and NEON™ provides significant processing power for customer applications including computer vision, wireless networking, and multi-sensor stitching algorithms. The H3’s hardware de-warping engine supports wide-angle panoramic camera designs and fish-eye lenses.

Ambarella will demonstrate the new H3 SoC at a private, invitation only event held during the Consumer Electronics Show (CES) in Las Vegas, January 5 – 8, 2017.

For pricing and availability, please contact Ambarella at www.ambarella.com/about/contact/inquiries
The URL for this news release is www.ambarella.com/about/news-events.html
The URL for the related image is www.ambarella.com/about/news-events/press-images/H3-press-images.html

About Ambarella

Ambarella, Inc. (NASDAQ: AMBA), is a leading developer of low power, high-definition and Ultra HD video compression and image processing solutions. The company’s products are used in a variety of cameras including security IP-cameras, wearable cameras, flying cameras and automotive video processing solutions. Ambarella compression chips are also used in broadcasting TV programs worldwide. Ambarella is the recipient of the Global Semiconductor Alliance 2015 awards for “Most Respected Public Semiconductor Company” and “Best Financially Managed Semiconductor Company,” both with sales of between $100M and $500M. For more information about Ambarella, please visit www.ambarella.com.

All brand names, product names, or trademarks belong to their respective holders. Ambarella reserves the right to alter product and service offerings, specifications and pricing at any time without notice. ©2017 Ambarella. All rights reserved.



Contact:

Ambarella:
www.ambarella.com/about/contact/inquiries
or
Media:
Valley Public Relations
Molly McCarthy
Email Contact
or
Investor Relations:
Deborah Stapleton, +1 650-815-1239
Email Contact

Featured Video
Jobs
Senior Principal Software Engineer for Autodesk at San Francisco, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Manufacturing Engineering Manager for Google at Sunnyvale, California
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise