According to the agreement, SMIC and IMECAS will work together closely to take advantage of IMECAS's experiences in MEMS Sensor design and packaging technology design and SMIC's standardized process technology platforms, industry and market influence. Starting with the development of a MEMS environmental sensor and combining the features of other types of MEMS Sensors, SMIC and IMECAS will collaborate to create a platform-based standard as well as mass production technologies to shorten the development cycle from design to production, thus helping the MEMS industry grow more effectively and efficiently.
"SMIC's R&D team has made a lot of achievements in developing new sensor technology platforms and introducing new customers. SMIC is willing to open our platforms to support commercialized production and the R&D of universities and research institutions," said Dr. Tzu-Yin Chiu, Chief Executive Officer and Executive Director of SMIC. "SMIC and IMECAS have cooperated in numerous logic process development projects. This time we will expand our collaboration and promote the R&D of complete standardized MEMS sensor technologies to help integrate and improve the MEMS supply chain."
Ye Tianchun, Director of IMECAS, visited SMIC's middle-end production line of MEMS sensors and said, "Through the cooperation between SMIC and IMECAS, we can exploit our advantages and jointly build an open MEMS technology service platform and an electronic information integration platform for the MEMS supply chain. With the integration of design, manufacturing, packing, testing, public platform and venture investment, we can form a supply chain ecosystem and support the development of a global as well as domestic Chinese MEMS industry."
About SMIC
Semiconductor Manufacturing International Corporation ("SMIC"; NYSE: SMI; SEHK: 981) is one of the leading semiconductor foundries in the world and the largest and most advanced foundry in mainland China. SMIC provides integrated circuit (IC) foundry and technology services on process nodes from 0.35 micron to 28 nanometer. Headquartered in Shanghai, China, SMIC has an international manufacturing and service base. In China, SMIC has a 300mm wafer fabrication facility (fab) and a 200mm mega-fab in Shanghai; a 300mm mega-fab and a majority-owned 300mm fab for advanced nodes in Beijing; 200mm fabs in Tianjin and Shenzhen; and a majority-owned joint-venture 300mm bumping facility in Jiangyin; additionally, in Italy SMIC has a majority-owned 200mm fab. SMIC also has marketing and customer service offices in the U.S., Europe, Japan, and Taiwan, and a representative office in Hong Kong. For more information, please visit www.smics.com.
Safe Harbor Statements
(Under the Private Securities Litigation Reform Act of 1995)
This press release contains, in addition to historical information, "forward-looking statements" within the meaning of the "safe harbor" provisions of the U.S. Private Securities Litigation Reform Act of 1995. These forward-looking statements, including statements under "Fourth Quarter 2016 Guidance", "CapEx Summary" and the statements contained in the quotes of our CEO are based on SMIC's current assumptions, expectations and projections about future events. SMIC uses words like "believe," "anticipate," "intend," "estimate," "expect," "project," "target" and similar expressions to identify forward-looking statements, although not all forward-looking statements contain these words. These forward-looking statements involve significant risks, both known and unknown, uncertainties and other factors that may cause SMIC's actual performance, financial condition or results of operations to be materially different from those suggested by the forward-looking statements including, among others, risks associated with the cyclical nature of the semiconductor industry, changes in demand for our products, competition in our markets, our reliance on a small number of customers, orders or judgments from pending litigation, intensive intellectual property lawsuits in semiconductor industry and financial stability in end markets, general economic conditions and fluctuations in currency exchange rates.
Investors should consider the information contained in SMIC's filings with the U.S. Securities and Exchange Commission ("SEC"), including its annual report on 20-F filed with the SEC on April 25, 2016, especially the consolidated financial statements, and such other documents that SMIC may file with the SEC or The Hong Kong Stock Exchange Limited ("SEHK") from time to time, including current reports on Form 6-K. Other unknown or unpredictable factors also could have material adverse effects on SMIC's future results, performance or achievements. In light of these risks, uncertainties, assumptions and factors, the forward-looking events discussed in this press release may not occur. You are cautioned not to place undue reliance on these forward-looking statements, which speak only as of the date stated, or if no date is stated, as of the date of this press release. Except as may be required by law, SMIC undertakes no obligation and does not intend to update any forward-looking statement, whether as a result of new information, future events or otherwise.
SMIC Media Contact
Terry Ding
+86-21-3861-0000 x16812
Email Contact
About IMECAS
The Institute of Microelectronics of the Chinese Academy of Sciences ("IMECAS") has become a key research institution integrated with both fundamental research and technology development, which is quite industry-oriented. It is also an entity of two centers and one college under the name of CAS. They are the CAS R&D Center for The Internet of Things, the CAS EDA Center (Electronic Design Automation Center) and the college of Microelectronics of UCAS (University of the Chinese Academy of Sciences). There are 14 departments at IMECAS including two key CAS Laboratories, four R&D centers for industry service, five R&D centers for typical applications, and three R&D centers for core product development. Among which, the Smart Sensing Center is conducting the research and development of sensor design, fabrication, packaging and testing. The CAS R&D Center for The Internet of Things has also established public service platforms, including a MEMS Design and Manufacture Platform and SIP Packaging Platform, a Communication System and Chip Design Test and Verification Platform, and more. For more information, please visit http://english.ime.cas.cn.
IMECAS Media Contact
Qiang Ma
Telephone: +86-10-82995658
Email:
Email Contact
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SOURCE Semiconductor Manufacturing International Corporation
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