San Jose, Calif. – August 23, 2016 – Sonics, Inc., the world’s foremost supplier of on-chip network (NoC) and power management technologies and services, today announced that Starblaze Technology has completed a new solid state drive (SSD) controller chip using SonicsGN® to integrate more than 60 cores. Starblaze was founded in January, 2015 and offers world-class chip design capabilities from its research and development centers in Beijing, Shanghai, and Chengdu, China. The company selected SonicsGN as the NoC for this enterprise SSD controller chip design due to its advanced performance features, intuitive development environment, and support for standard EDA design flows. Starblaze completed tape out of this SSD controller chip in April, 2016 and is targeting it for volume production in TSMC’s 28HPC process technology later this year.
“We continue to see strong adoption of our NoCs in the Chinese market by companies that want rapid integration capabilities coupled with high performance on-chip communication,” said Grant Pierce, CEO of Sonics. “Many of the world’s top Internet companies are using Starblaze’s SSD chips inside storage products at their data centers to accelerate information access and online business transactions. We are proud to be part of Starblaze’s continuing success.”
“The enterprise SSD market is evolving rapidly, so our SoC integration technology has to be flexible enough to adapt quickly while delivering enterprise-class performance,” said Sky Shen, CEO of Starblaze. “Only Sonics provided the combination of NoC technology leadership, optimized features, and a 20-year track record of customer success to meet our requirements.”
About Sonics, Inc.
Sonics, Inc. (Milpitas, Calif.) is the trusted leader in on-chip network (NoC) and power-management technologies used by the world’s top semiconductor and electronics product companies, including Broadcom®, Intel®, Marvell®, MediaTek, and Microchip®. Sonics was the first company to develop and commercialize NoCs, accelerating volume production of complex systems-on-chip (SoC) that contain multiple processor cores. Sonics’ ICE-G1™, based on the ICE-Grain™ Power Architecture, is the industry’s first complete Energy Processing Unit (EPU), which enables rapid development of SoC power management subsystems. Sonics is also a catalyst for ongoing discussions about design methodology change via the Agile IC Methodology LinkedIn group. Sonics holds approximately 150 patent properties supporting customer products that have shipped more than four billion SoCs. For more information, visit sonicsinc.com
