Expo Floor to Feature Innovations from Keysight Technologies, National Instruments, Samtec & More

SAN FRANCISCO, Jan. 11, 2016 — (PRNewswire) —  Today DesignCon previews an array of announcements from exhibitors participating at DesignCon 2016 next week. The event will feature an expansive expo floor welcoming industry-leading companies showcasing the most innovative products and services advancing chip, board and systems design. The event will take place January 19-21 at the Santa Clara Convention Center. For additional information and to register, please visit: designcon.com.

"Each year, DesignCon brings together the most inventive companies to help our attendees evaluate the latest high-speed design tools, technologies and industry developments," said DesignCon General Manager, Joseph Marks. "This year is no exception – DesignCon 2016 will host the largest expo floor in event history, with more than 160 total exhibitors, of which 40 have shared exciting announcements in anticipation of the event."

Below is a preview of announcements exhibitors will showcase at DesignCon 2016:

AirBorn Inc. (booth 306) announces significant enhancements to their HD4 Interconnect Solution. Improvements include "inverted T" termination on the board mount connector, solid conductor and stranded wire options, enhanced backshell casing as well as UL, CSA and RoHS certifications.

Amphenol (booth 635) is excited to showcase the following new product offerings: RCx optimized copper intra-rack I/O system, derivatives of the Paladin Interconnect System including Ortho Mate and Cable Backplane, Cool Edge Interconnect System, 100G AOCs, and Ultraspeed high performance PCB technology.

ANSYS (booth 843 ) new Chip-Package-System (CPS) design flow delivers unparalleled simulation capacity and speed for power integrity, signal integrity and EMI analysis. Automated thermal analysis and integrated structural analysis capabilities provide coupled chip-aware and system-aware simulation for CPS design, enabling customers to perform end-to-end multiphysics analysis.

ARC Technologies, Inc. (booth 1246) will showcase new product and service offerings including AC²ES products, Hot Melt Absorber products, Testing, and Electroless Copper Plating services.

Artek Inc. (booth 314) will introduce the passive variable skew adjuster. For the purpose of receiver tolerance testing against skew impairment, the variable skew adjuster can easily change the intra-pair skew.

Bellwether (booth 653) will show our high speed Pogo pin connector and the FFC cable which can meet USB 3.0/3.1 signal integrity requirements. Both of them can provide a more flexible system architecture. Our high retention force wire-to-board connector can provide excellent 4-direction wrenching strength resistance.

Carlisle Interconnect Technologies (booth 1135) launches a lineup of innovative products designed to deliver high signal integrity in increasingly dense applications. New products include the CoreGD™ and CoreHC™ RF adapters, Secure-Thread, one of the smallest threaded lock connectors available, and the Passive Probe, a 500Mhz CAT III/IV general-purpose, high voltage probing solution.

Dino-Lite (booth 322) announces the 5MP Edge series. Edge series units contain an enhanced sensor for improved image quality. New features include Extended Depth of Field (EDOF), Extended Dynamic Range (EDR), and Automatic Magnification Reading (AMR). The 5MP Edge scopes features Flexible LED Control (FLC) to enable partial illumination.

DVT Solutions (booth 545), LLC/Signal Microwave announces a new "VNA Post Calibration Measurement Board" to verify measurement results or drift over a 70 GHz frequency range. Optional 40GHz/70 GHz LRM or LRL calibration structures can be added for establishing the measurement reference plane for probes or fixtures.

Elite Material Company, Ltd. (booth 202) is proud to announce the addition of EM-891 & EM-891(K) to our industry leading brand of high speed "Green" PCB laminates.

EMA Design Automation (booth 506) will be demonstrating the new OrCAD Sigrity ERC. This product enables signal quality analysis screening for your entire PCB design. No models or complex setup required. Let your SI experts handle the really tough problems. Solve all the rest with OrCAD Sigrity ERC.

Focus Display Solutions' (booth 1247) new design process flow allows rapid Prototyping of VATN displays. FDS is presenting its new Vertically Aligned Twisted Nematic (VATN) LCD technology focuslcds.com/products/custom-lcd/custom-vatn-displays. VATN modules produce a brighter backlight, increased sharpness, multiple color display characters/icons and a wider viewing angle than older twisted nematic technologies.

Hampoo (booth 1138), will be showcasing its one-stop service from pcb design to manufacturing to end product in smart home, IOT, industrial control, new energy and automotive applications.

i3 Electronics (booth 1155) will showcase their advanced printed circuit board and semiconductor packaging technology for the industrial, commercial, medical and aerospace industries. In addition, i3 will be highlighting their world-class advanced laboratory services and their Current Induced Thermal Cycling (CITC) test technology, which holds many distinct advantages over traditional printed circuit board reliability tests.

INGUN (booth 320) is proud to announce its latest RF&Microwave probing technologies (12 GHz narrow form factor flange-mount probes) and its new developments in the high-current probe field (spring-loaded contacts to test flat-blade and round-post automotive connectors).

Ironwood Electronics (booth 750) is proud to announce 75GHz bandwidth test sockets for engineering application. GT is a new elastomer technology that has silver particles held in a conductive column, similar to buttons, which are embedded in a non-conductive polyimide substrate on a proper pitch that provides high compliance and extreme temperature ranges.

Keysight (booth 725) will demonstrate a broad range of simulation, test, and compliance solutions designed to help engineers address the challenges presented across a variety of digital technologies, including the industry's latest evolving standards. Keysight will also conduct its Keysight Education Forum (KEF), reviewing the latest in high speed digital solutions.

KITAGAWA INDUSTIRES America, Inc. (booth 415) is proud to introduce its newly upgraded EMPV4 series, EMC and thermal dual function material. This silicone-free material provides excellent EMI noise suppression performance with higher permeability. Soft material allows for higher thermal performance by reducing thermal resistance.

Linear Systems (booth 1245) will discuss its new N channel and P channel JFETs, launching early 2016, and distribute copies of its newest white paper, 'Reducing Sensor Signal Chain Noise Using Linear Systems Discrete Components' by Ron Quan.

Lorom America (booth 502) is proud to demo the future of copper with channel speeds in excess of 320 GB/S in the existing QSFP+ form factor. Additionally, our new 28G SFP+/QSFP+ Passive Cables features a proprietary low loss cable technology, lowering cooling costs and reduced power consumption compared to fiber.

Meritec (booth 520) is featuring its new Hercules High-Speed interface used in VITA 76.0 now embedded in the new (HS-D) D-Sub rugged-rectangular MIL-DTL-24308 shell providing high-bandwidth, high-pin count and durability suitable for Mil/Aero & rugged commercial applications not previously accommodated by industry-standard connectors. 

Micro-Coax (booth 1055) has launched three new microminiature coaxial cables and connector design capability to support them. The new cables are: TGZ025D, a true flexible cable with an outer diameter of 0.65 mm, UT-020-TP, a tin-plated version of their popular semi-rigid cable and UT-042, the newest member of their semi-rigid lineup.

Molex (booth 817) will be debuting advanced heat dissipation options, analysis tools, backplane solutions, and other products including High-Speed Low-Loss Flex Circuit Assemblies, fabricated using DuPont™ Pyralux® TK flexible circuit material, the NeoPress High-Speed Mezzanine System and the Impel™ Backplane Connector System.