TOKYO — (BUSINESS WIRE) — November 28, 2014 — Toshiba Corporation (TOKYO:6502) today announced the launch of three new application processors, the “TZ2100 group,” as the latest additions to its ApP LiteTM family’s ARM® Cortex®-A9-based “TZ2000 series”.
Toshiba: ARM(R) Cortex(R)-A9 Based Application Processors "TZ2100 Group" with Enhanced Sound and Image Data-Mining and Security Functions (Photo: Business Wire)
The “TZ2100 group” are high performance application processors supporting enhanced sound and image data-mining, communications and security functions. Sample shipments will start from mid-December, with mass production scheduled to start in June, 2015.
Recent advances in big data are making it easier to sift through huge volumes of data and to develop services that provide users with greater value and convenience. These advances require higher performance application processors that support secure communication and provide timely processing of text, sound and images. “TZ2100 group” devices can operate at a maximum frequency at 600MHz, a rate supporting high speed processing. They are ideal for a wide range of products such as the embedded devices that will realize the Internet of Things (IoT), handheld devices, and industrial equipment.
Toshiba will also launch development starter kits for the “TZ2100 group” from December on, comprising a reference board and device driver. These will support a simple prototype development and evaluation environment for diverse applications.
Key Features of New Products
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ARM® Cortex®-A9 operating at 600MHz
L1 Cache: 32KByte, L2 Cache: 128KByte, Embedded FPU
300MHz version is also available.
- Accommodates DDR3-800/DDR3L-800 16bit width
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Toshiba’s original power-saving technology enables long time data
back-up and RTC operation
Enables long time data back-up and RTC operation with one single coin cell battery.
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Camera input, graphics and LCD output
Suitable specification for applications such as panel control devices.
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Secure boot system and data encryption function
Building-up robust secure system which uses encryption circuit is available as an option. Incorporating program area in a chip can be robust against data falsifying and hacking.
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1MByte SRAM built-in
1MByte of built-in SRAM supports processing of start-up code and data during program execution, without any need for external DRAM.
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External expanded bus interface
Supports use of memory with an external connection, which is necessary for amusement devices and industrial equipment.
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Customers can choose suitable specifications by setting up a
“Configuration pin”
Supports a wide range of applications, from small display devices to industrial equipment.
About ApP LiteTM
The IoT will see more and more devices connected to the internet and to each other. Increasingly, functions to process a wide variety of data from simple text to data-heavy audio and visual sources effectively and to transfer them safely are required. ApP LiteTM (Application Processor Lite) microprocessors are ideal for such processing.
Applications
Industrial equipment, home appliances, amusement devices, education equipment
Main Specifications of New Products |
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Part Number | TZ2002XBG | TZ2003XBG | TZ2100XBG | TZ2101XBG | TZ2102XBG | |||||
CPU |
ARM ® Cortex ® -A9 MPCore
|
ARM ® Cortex ® -A9 MPCore
|
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Max Operating Frequency | 200MHz | 300MHz | 600MHz | |||||||
FPU(Floating Point Unit) | Not integrated | Integrated | ||||||||
Secure Boot System Control, Encrypt Data Function | Non-supported | Supported | Non-supported | Supported | Non-supported | |||||
RAM | 1MByte SRAM |
1MByte SRAM
32KByte SRAM(for Back-up) |
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DRAM Controller |
DDR3/DDR3L×8bit |
DDR3/DDR3L×16bit | ||||||||
External Extended Bus Interface | Unintegrated |
Address: 27bit, Data:32bit |
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2D Graphic Engine | Toshiba original graphics accelerator | |||||||||
LCD Controller |
WVGA (800×480 pixel) 60fps, 24bit Parallel I/F |
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High Speed Interface Controller | USB2.0 host interface, USB2.0 device interface, 10/100 Ethernet MAC | |||||||||
Peripheral Functions | DMA controller, Timer/Counter, RTC | |||||||||
Peripherals |
UART×4, I 2 C×5, I 2 S×2, SPIB×4, PWM×5, 12bitADC×4, SDIO×2, eMMCx1, GPIO |
Camera I/F, UART×4, I 2 C×4, I 2 S×2, SPIM×7, SPIB×2,PWM×6, 12bitADC×4, SDIO×3, eMMCx1, GPIO | ||||||||
Power Supply Voltage | Core=1.1V, I/O=3.3V | Core=1.1V, I/O=3.3V | ||||||||
Package |
LFBGA 280pin
15mm×15mm, 0.8mm pitch |
LFBGA 310pin
16mm×16mm, 0.8mm pitch |
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Production Status | Mass production | Mass production from June 2015 |