New half-bridge module enables unprecedented reductions in cost and size for high power motor drive and grid-tie inverter applications
DURHAM, N.C. — (BUSINESS WIRE) — September 29, 2014 — Cree, Inc. ( Nasdaq: CREE) continues to extend its leadership in silicon carbide (SiC) power device technology with the release of the industry’s first all-SiC 1.7kV power module in an industry standard 62mm housing. Powered by Cree’s C2M™ large area SiC chip technology, the new half-bridge module exhibits an impressive 8mΩ on-resistance and 10-times higher switching efficiency than existing silicon (Si) module technology, capable of replacing Si IGBT modules rated at 400A or more. The breakthrough performance of the new 1.7kV all-SiC power module allows design engineers to simultaneously reduce the size and cost of magnetic and cooling elements while achieving superior system efficiency and reliability. Unlike existing silicon-based systems in motor drive, grid-tie and utility scale solar inverter applications, the new Cree® power module also enables lower production costs and the development of smaller, lighter products with a lower overall total cost of ownership.
“The introduction of Cree’s all-SiC 1700V power module opens the door for SiC devices to become the switching device of choice for high-power motor drives,” said Devin Dilley, director of medium voltage R&D for Vacon, a global supplier in the premium AC drives market. “The application of these modules in SiC-based motor drives will enable a reduction in the size and cost of filter components by up to 40 percent while simultaneously increasing system efficiency.”
The superior switching efficiency and voltage capability of this new module enables simplified two-level topologies that are feasible at higher frequencies, eliminating the need to invest in complex, multi-level silicon-based solutions. The high power density that can be achieved with Cree’s newest half-bridge module further simplifies the implementation of modular system designs and enables extremely low mean time to repair for high overall system availability.
“Our latest module solidifies Cree’s commitment to support the needs of our customers and the industry demand for lower system cost,” said Cengiz Balkas, general manager and vice president, Cree Power and RF. “By utilizing our state-of-the-art SiC technology, Cree’s power module portfolio enables higher efficiency, improved reliability and lower total cost of ownership.”
The new all-SiC 1.7kV, 8mΩ half-bridge module is available as part number CAS300M17BM2 at preferred distributors, including Mouser, Digi-Key and Richardson RFPD/Arrow RF & Power. Companion gate driver boards have been developed in cooperation with Prodrive, a Netherlands based innovator in power systems design and manufacturing. The boards are available through Cree sales channels or directly from ProDrive. Please visit http://www.cree.com/Power/Products/SiC-Power-Modules/SiC-Modules/CAS300M17BM2 for more information and access to data sheets, material content, and application notes.
About Cree
Cree is leading the LED lighting revolution and making energy-wasting traditional lighting technologies obsolete through the use of energy-efficient, mercury-free LED lighting. Cree is a market-leading innovator of lighting-class LEDs, LED lighting, and semiconductor products for power and radio frequency (RF) applications.
Cree’s product families include LED fixtures and bulbs, blue and green LED chips, high-brightness LEDs, lighting-class power LEDs, power-switching devices and RF devices. Cree® products are driving improvements in applications such as general illumination, backlighting, electronic signs and signals, power suppliers and solar inverters.
Please refer to www.cree.com for additional product and company information.
This press release contains forward-looking statements involving risks and uncertainties, both known and unknown, that may cause actual results to differ materially from those indicated. Actual results may differ materially due to a number of factors, including the risk that actual performance will vary from expectations; the risk we may be unable to manufacture these new products with sufficiently low cost to offer them at competitive prices or with acceptable margins; the risk we may encounter delays or other difficulties in ramping up production of our new products; customer acceptance of our new products; the rapid development of new technology and competing products that may impair demand or render Cree’s products obsolete; and other factors discussed in Cree’s filings with the Securities and Exchange Commission, including its report on Form 10-K for the year ended June 29, 2014, and subsequent filings.
Cree® is a registered trademark and C2M™ is a trademark of Cree, Inc.
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