Demos and Speakers Showcase Advanced ARM® Processor-based Offering, 2.5D Packaging

Milpitas, Calif., Sept. 24, 2014 – Open-Silicon, an ASIC solutions provider, today announced it will participate in ARM ® TechCon 2014 with booth demonstrations showcasing the company’s ARM processor-based ASIC design and manufacturing experience, as well as its 2.5D packaging capability.  The company will also present a paper on 2.5 packaging.

What:

Open-Silicon Booth:

The Open-Silicon booth will showcase the company’s extensive background in the development of ARM processor-based System-on-Chip (SoC) and ASIC devices.  The company will demonstrate a quad-core design targeted for use in residential gateways, showcasing its experience in working with customers from initial concept through to fully manufactured and packaged parts.  Open-Silicon will also demonstrate its 2.5D packaging capabilities.

When:          Exhibit Hours are Wednesday, October 1, 11 a.m. - 6 p.m. and Thursday, October 2, 10:30 a.m. - 5:30 p.m.

Where:        Booth #214, Santa Clara Convention Center, Santa Clara, Calif.  95054

Presentation:

Open-Silicon will conduct a presentation entitled, “Exploring the 2.5D Interconnect Frontier,” that will explore the many possibilities and trade-offs for defining a System-in-Package (SiP) using 2.5D packaging technology. It will primarily focus on defining a die-to-die interface, from the logical/functional perspective as well as the physical/electrical perspective, and closely follows the progression of the industry’s first working 2.5D SiP device, co-developed by Open-Silicon and unveiled at ARM TechCon 2013.

Who:            Jeff Scott, principal SoC architect for Open-Silicon

When:          Thursday, October 2 at 3:30 p.m.

Where:        Santa Clara Convention Center

About Open-Silicon

Open-Silicon transforms ideas into system-optimized ASIC solutions within the time-to-market parameters desired by customers.  The company enhances the value of customers’ products by innovating at every stage of design – architecture, logic, physical, system and software – and then continues to partner to deliver fully tested silicon and platforms.  Open-Silicon applies an open business model that enables the company to uniquely choose best-in-industry IP, design methodologies, tools, software, packaging, manufacturing and test capabilities.  The company has partnered with over 150 companies ranging from large semiconductor and systems manufacturers to high-profile start-ups, and has successfully shipped nearly a hundred million ASICs to date.  Privately-held, Open-Silicon employs over 250 people in Silicon Valley and around the world.  www.open-silicon.com

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Open-Silicon is a trademark and service mark of Open-Silicon, Inc. registered in the United States and other jurisdictions.  ARM is a registered trademark of ARM Ltd.  All other trademarks are the property of their respective holders.