HLMC licensed Cypress's 55-nanometer SONOS embedded nonvolatile memory (NVM) process in January 2014. The technology provides significant advantages over other embedded NVM offerings. SONOS only requires three mask layers to insert it into a standard CMOS process compared with the nine to twelve additional masks generally needed for other embedded Flash technologies. This mask reduction results in lower manufacturing costs. SONOS does not alter standard device characteristics or models when it is added to baseline CMOS process, preserving existing design IP. SONOS delivers intrinsically high yields and best-in-class reliability, 10 years of data retention, 100,000 program/erase endurance cycles, and robust resistance to soft errors. Cypress has demonstrated the ability to scale SONOS to 40-nm and 28-nm nodes, expediting future IP development.
"We are pleased to achieve this milestone with Cypress's 55-nm SONOS, as it marks a significant step in bringing the benefits of the technology to our customers," said Jack Qi Shu, Vice President at HLMC. "SONOS is a cost-effective process that delivers proven high yields. Its reliability and efficiency are key for high-volume Internet of Things applications and smartcards."
"Achieving working 55-nm SONOS silicon cells with HLMC is a testament to the technology's scalability and ease-of-design and to HLMC's manufacturing expertise," said Sam Geha, Vice President of the Technology and Intellectual Property Business Unit at Cypress. "The low cost, high performance and reliability of SONOS are ideal for the rapidly growing smartcard and Internet of Things markets, as well as for bank cards, wearable electronics and other logic-dominated products. Cypress will continue to work with leaders such as HLMC to make SONOS the industry's embedded nonvolatile memory platform of choice."
About Shanghai Huali Microelectronics
Founded in January, 2010 at Shanghai Zhangjiang Hi-tech Park, Shanghai Huali Microelectronics Corporation ("HLMC") is one of the most advanced pure-play wafer foundries in mainland China. HLMC owns a 300mm fab with maximum full capacity of 35000 wafers per month. HLMC's process technologies start from 55nm technology node and mainly cover 55nm LP, 40nm LP, 55nm HV, 55nm e-Flash and specialty technologies for a wide range of applications. HLMC is devoted to providing domestic and overseas customers with comprehensive foundry solutions and value-added services. Learn more about HLMC online at
www.hlmc.cn.
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About Cypress
Cypress delivers high-performance, mixed-signal, programmable solutions that provide customers with rapid time-to-market and exceptional system value. Cypress offerings include the flagship PSoC® 1, PSoC 3, PSoC 4 and PSoC 5LP programmable system-on-chip families. Cypress is the world leader in capacitive user interface solutions including CapSense® touch sensing, TrueTouch® touchscreens, and trackpad solutions for notebook PCs and peripherals. Cypress is a world leader in USB controllers, which enhance connectivity and performance in a wide range of consumer and industrial products. Cypress is also the world leader in SRAM and nonvolatile RAM memories. Cypress serves numerous major markets, including consumer, mobile handsets, computation, data communications, automotive, industrial and military. Cypress trades on the NASDAQ Global Select Market under the ticker symbol CY. Visit Cypress online at
www.cypress.com.
Cypress, the Cypress logo, PSoC, CapSense and TrueTouch are registered trademarks and S65 is a trademark of Cypress Semiconductor Corp. All other trademarks are property of their owners.
Contacts: Samer Bahou Cypress PR (408) 232-4552 Email Contact Olivia Wen Huali Microelectronics (86 21) 6187 1212 ext. 0512 Email Contact
