Combined CMOS-DMOS Process Reduces Heat Generation by 30%

TOKYO — (BUSINESS WIRE) — December 8, 2013 — Toshiba Corporation (TOKYO:6502) today announced the launch of “TC7761WBG”, a wireless power receiver IC that complies with Qi Standard¹ Low Power Specifications version1.1, defined by the Wireless Power Consortium (WPC). The IC will be used in wireless power supply applications, such as smartphones and mobile accessories. Mass production shipments start today.
ICs used in mobile applications including smartphones, are required to generate heat at low level, to prevent overheating. The “TC7761WBG” is fabricated with a combined CMOS-DMOS wafer process that cuts heat generation to 70% that of an equivalent product² while achieving 95% power conversion efficiency. The IC’s built-in protocol authentication circuit eliminates the need for an external microcontroller, contributing to simplification of the system.

Toshiba: "TC7761WBG", a wireless power receiver IC that complies with Qi Standard Low Power Specifications version1.1. (Photo: Business Wire)

Key Features of New Product

• Reduces heat generation by 30%.
• Achieves 95% maximum power conversion efficiency.
• Integrates protocol authentication circuit of Qi standard
• Complies with Qi Low Power Specifications version1.1 that includes FOD (Foreign Object Detection) function.
• Awarded Qi certification at output power of 3.5W.

Applications

Mobile devices such as smartphones and mobile accessories

Notes:
1: The international standard for wireless charging, defined by the Wireless Power Consortium.
2: Comparison with “TB6862WBG”.