SmartFusion2 SoC FPGAs Also Achieve CAN and USB 2.0 Certifications

ALISO VIEJO, Calif., Nov. 20, 2013 — (PRNewswire) —  Microsemi Corporation (Nasdaq: MSCC), a leading provider of semiconductor solutions differentiated by power, security, reliability and performance, today announced that its SmartFusion^®2 SoC FPGAs and IGLOO^®2 FPGAs have achieved PCI^® Express (PCIe) 2.0 endpoint specification certification and are now included on the PCI SIG Integrators List. According to the company's testing results, the newly certified devices are the industry's lowest power PCIe 2.0 programmable logic solutions, providing a reduction of up to 10X static power consumption compared to other programmable logic devices with comparable mainstream features. Additionally, these innovative solutions deliver unparalleled security and reliability making them ideal for high-availability, low-power applications in communications infrastructure equipment, programmable logic controllers (PLCs), medical diagnostic equipment and bridging applications in defense equipment.

"By leveraging the integrated PCIe blocks in our SmartFusion2 SoC FPGAs and IGLOO2 FPGAs designers can meet the high system bandwidth and programmable systems integration requirements needed in communications, industrial, aviation and defense applications at significantly lower power than competitive devices," said Venkatesh Narayanan, director of Software & Systems Engineering for Microsemi's SoC Products Group. "Certifying the embedded hard IP in our groundbreaking solutions also helps our customers accelerate time-to-market, while providing an added level of assurance that our products deliver the performance called for in key industry standards."

In addition, the company recently attained industry compliance certifications for hard intellectual property (IP) embedded in its industry-leading SmartFusion2 SoC FPGAs including controller area network (CAN) and USB 2.0. By certifying these broadly used communications interfaces Microsemi customers can expect correct operation in their systems enabling a shorter design cycle time which lowers their overall cost of ownership all in a low power, secure and reliable SoC FPGA.

Certification List:

SmartFusion2 SoC FPGAs and IGLOO2 FPGAs are available in production quantities now, along with a full suite of development tools. 

About SmartFusion2 SoC FPGAs
Microsemi's SmartFusion2 SoC FPGAs are designed to address fundamental requirements for advanced security, high reliability and low power in critical communications, industrial, defense, aviation and medical applications. SmartFusion2 integrates inherently reliable flash-based FPGA fabric, a 166 megahertz (MHz) ARM Cortex-M3 processor, advanced security processing accelerators, DSP blocks, SRAM, eNVM and industry-required high performance communication interfaces, all on a single chip.

About IGLOO2 FPGAs
Microsemi's IGLOO2 FPGAs continue the company's focus on addressing the needs of today's cost-optimized FPGA markets by providing a LUT based fabric, 5G transceivers, high speed GPIO, block RAM, a high-performance memory subsystem, and DSP blocks in a differentiated, cost and power optimized architecture. This next generation IGLOO2 architecture offers up to five times more logic density and three times more fabric performance than its predecessors and combines a non-volatile flash based fabric with the highest number of general purpose I/Os, 5G SERDES interfaces and PCI Express end points when compared to other products in its class. IGLOO2 FPGAs offer best-in-class feature integration coupled with the lowest power, highest reliability and most advanced security in the industry.

Pricing and Availability
SmartFusion2 SoC FPGAs and IGLOO2 FPGAs are shipping in volume production now. For more information on SmartFusion2 SoC FPGAS, visit: http://www.microsemi.com/products/fpga-soc/soc-fpga/smartfusion2. For more information about Microsemi's IGLOO2 FPGAs, visit http://www.microsemi.com/products/fpga-soc/fpga/igloo2-fpga. Customers can also contact sales at Email Contact.

About Microsemi
Microsemi Corporation (Nasdaq: MSCC) offers a comprehensive portfolio of semiconductor and system solutions for communications, defense & security, aerospace and industrial markets. Products include high-performance and radiation-hardened analog mixed-signal integrated circuits, FPGAs, SoCs and ASICs; power management products; timing and voice processing devices; RF solutions; discrete components; security technologies and scalable anti-tamper products; Power-over-Ethernet ICs and midspans; as well as custom design capabilities and services. Microsemi is headquartered in Aliso Viejo, Calif., and has approximately 3,000 employees globally. Learn more at www.microsemi.com.

Microsemi and the Microsemi logo are registered trademarks or service marks of Microsemi Corporation and/or its affiliates. Third-party trademarks and service marks mentioned herein are the property of their respective owners.

"Safe Harbor" Statement under the Private Securities Litigation Reform Act of 1995: Any statements set forth in this news release that are not entirely historical and factual in nature, including without limitation statements related to industry certifications related to its SmartFusion2 SoC FPGAs and IGLOO2 FPGAs achieving PCI Express 2.0 endpoint specification certification, as well as receiving industry compliance certifications for hard intellectual property embedded in its industry-leading SmartFusion2 SoC FPGAs, and its potential effects on future business, are forward-looking statements. These forward-looking statements are based on our current expectations and are inherently subject to risks and uncertainties that could cause actual results to differ materially from those expressed in the forward-looking statements. The potential risks and uncertainties include, but are not limited to, such factors as rapidly changing technology and product obsolescence, potential cost increases, variations in customer order preferences, weakness or competitive pricing environment of the marketplace, uncertain demand for and acceptance of the company's products, adverse circumstances in any of our end markets, results of in-process or planned development or marketing and promotional campaigns, difficulties foreseeing future demand, potential non-realization of expected orders or non-realization of backlog, product returns, product liability, and other potential unexpected business and economic conditions or adverse changes in current or expected industry conditions, difficulties and costs of protecting patents and other proprietary rights, inventory obsolescence and difficulties regarding customer qualification of products. In addition to these factors and any other factors mentioned elsewhere in this news release, the reader should refer as well to the factors, uncertainties or risks identified in the company's most recent Form 10-K and all subsequent Form 10-Q reports filed by Microsemi with the SEC. Additional risk factors may be identified from time to time in Microsemi's future filings. The forward-looking statements included in this release speak only as of the date hereof, and Microsemi does not undertake any obligation to update these forward-looking statements to reflect subsequent events or circumstances.