Research and Markets ( http://www.researchandmarkets.com/research/n8wd3c/stmicroelectronics) has announced the addition of the "STMicroelectronics LSM333D 4x4mm 9-Axis IMU Reverse Costing Analysis" report to their offering.

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System Plus Consulting is proud to publish the reverse costing report of the new 9-DOF IMU supplied by STMicroelectronics.

The LSM333D is a 4x4mm system-in-package featuring a 3axisgyroscope, a 3-axis accelerometer and a 3-axismagnetometer.

ST achieves to obtain this package footprint by combining the 3-axis gyroscope and the 3-axis accelerometer function on the same die. This new structure, combined with an Au-Au hermetic bonding process allow ST's to shrink the 6-axis function by more than 35%.

The LSM333D is targeted for portable applications: indoor navigation, smart user interface, advanced gesture recognition, gaming and virtual reality input device It provides accurate output across full-scale ranges up to ±2000dps (rotational acceleration), ±16g (linear acceleration) and ±12 Gauss (magnetic field).

This report provides complete teardown of the 9-Axis IMU with:

- Detailed photos
- Material analysis
- Schematic assembly description
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:

Overview / Introduction
- Executive Summary
- Reverse Costing Methodology

Companies Profile

Physical Analysis
- Package X-Ray
- Package Opening
- Package Cross-Section
- ASICs Dimensions
- ASICs Delayering
- ASICs Cross-Section
- MEMS Gyro/Accelero Dimensions
- MEMS Gyro/Accelero Cap Opening
- MEMS Gyro/Accelero Sensing Areas
- MEMS Gyro/Accelero Cross-sections
- X/Y-Axis Magnetometer Dimensions
- X/Y-Axis Magnetometer Delayering
- X/Y-Axis Magnetometer Cross-section
- Z-Axis Magnetometer Dimensions
- Z-Axis Magnetometer Delayering
- Z-Axis Magnetometer Cross-section

Manufacturing Process Flow
- Front-End Manufacturing Process Flows
- Description of the Wafers Fabrication Units
- Back-End Packaging Process Flow
- Back-End Packaging Assembly Unit

Cost Analysis
- Yields Hypotheses
- ASICs Wafer Cost
- ASICs Die Cost
- MEMS Gyro/Accelero Wafer Cost
- MEMS Gyro/Accelero Die Cost
- X/Y-Axis Magnetometer Wafer Cost
- X/Y-Axis Magnetometer Die Cost
- Z-Axis Magnetometer Wafer Cost
- Z-Axis Magnetometer Die Cost
- Back-End: Packaging Cost
- Back-End: Final test & Calibration Cost
- LSM333D Component Cost (FE + BE 0 + BE 1)

Estimated Price Analysis
- Manufacturer Financial Ratios
- LSM333D Estimated Selling Price

For more information visit  http://www.researchandmarkets.com/research/n8wd3c/stmicroelectronics

Research and Markets
Laura Wood, Senior Manager.
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Sector: Telecommunications and Networks

SOURCE Research and Markets