MILPITAS, Calif., April 5, 2013 -- Open-Silicon, Inc., a leading semiconductor design and manufacturing company, today announced that it has extended its TSMC Value Chain Aggregator (VCA) program membership to include Israel. Open-Silicon has been a TSMC partner in North America since its founding in 2003.

Open-Silicon has had a presence in Israel for almost ten years and is highly committed to its goal of providing best-in-class ASIC design services in the region. Through its collaborative relationship with TSMC, Open-Silicon can build on its existing relationships in Israel and continue to provide front-end design services such as ASIC architecture, RTL design and design verification, as well as physical design and complete manufacturing services. 

"We're proud that TSMC has selected Open-Silicon as a VCA member in Israel," said Dr. Naveed Sherwani, president and CEO of Open-Silicon. "Through our collaborative relationship with TSMC we can more easily meet our goal of delivering customer-centric solutions, operational excellence and high customer satisfaction."

"Building on Open-Silicon's track record in Israel, TSMC is pleased to welcome Open-Silicon to the VCA program in Israel where Open-Silicon leverages its value-added services, local presence and design expertise to best serve emerging and system companies. We look forward to extending the VCA service reach with Open-Silicon for Israeli customers," said Maria Marced, President of TSMC Europe BV.

TSMC's VCA program was developed to integrate design enablement building blocks within TSMC's Open Innovation Platform™ (OIP) and provide specific services at each link in the IC value chain, including IP development, design backend, wafer manufacturing, assembly and testing.

About Open-Silicon, Inc.

Open-Silicon, a leading supplier and developer of customer-specific products (CSPs), provides ASICs, platforms, concept-to-parts development, customized IP, low-effort derivative design, and state-of-the-art manufacturing solutions.  With Open-Silicon, customer's benefit from global engineering including an ARM® Technology Center of Excellence, advanced SerDes integration, 2.5D interposer-based package engineering, experienced architects, leading-edge physical design methodology, and embedded software development, all leveraging the industry's best technology from both Open-Silicon and the open market. For more information, visit Open-Silicon's website at  www.open-silicon.com or call 408-240-5700.