Cadence Synthesis Technology Speeds Time to Production for Renesas Micro Systems

SAN JOSE, CA -- (Marketwire) -- Nov 26, 2012 -- Cadence Design Systems, Inc. (NASDAQ: CDNS), a leader in global electronic design innovation, announced today that Renesas Micro Systems Co., Ltd. has adopted the Cadence® Encounter® RTL Compiler for synthesis, highlighting a utilization improvement of 15 percent, area reduction of 8.4 percent, quick turnaround time, and cost reduction for complex ASIC designs.

"Renesas Micro Systems has been working very closely with Cadence to develop best-in-class netlist analysis flows that provide early insights into potential structural issues and inefficiencies. Encounter RTL Compiler solved a problem we had been grappling with for a long while," said Kazuyuki Irie, chief professional, SoC Development Division of Renesas Micro Systems. "With our prior flow, we were frustrated with all the additional place-and-route cycles we were burning each time we analyzed and resolved problems with hot spots and routability. The Cadence technology offers us a faster and more cost-efficient way to get to production silicon."

In today's ASIC design development, there is an increased demand for ultra large-scale, high speed, and complex designs, and Renesas Micro Systems is focused on high-density layout, high speed, and short turnaround time for its ASIC designs. In the past, it was difficult for company engineers to fix serious routability issues after running place and route tools, resulting in longer turnaround times; if engineers identified hot spots, they were forced to run place and route tools to assist with maximum utilization, adjustment of placement congestion, floorplanning and circuit optimization.

Encounter RTL Compiler is unique in that it enables an environment for the structural analysis of a netlist early in the flow. This allows Renesas Micro Systems engineers to identify problematic structures in their designs before conducting place and route. By applying this methodology, they have been reducing turnaround time and easing congestion hot spots, which allows them to further improve utilization and reduce the die size.

In several ASICs -- down to 28 nanometers -- that have been manufactured, Renesas Micro Systems has reported overall utilization improved by as much as 15 percent over results from the company's prior methodology. By leveraging Encounter RTL Compiler, Renesas Micro Systems successfully completed several complex ASIC designs in a shorter period of time with reduced die size.

"Like many other technology companies, Renesas Micro Systems is seeking an edge in time-to-market and cost," said Dr. Chi-Ping Hsu, senior vice president of research and development, Silicon Realization Group, at Cadence. "As a key technology in the Cadence RTL-to-signoff flow, RTL Compiler offers unique capabilities that can get products to market faster while meeting today's aggressive die size requirements."

About Cadence
Cadence enables global electronic design innovation and plays an essential role in the creation of today's integrated circuits and electronics. Customers use Cadence software, hardware, IP, and services to design and verify advanced semiconductors, consumer electronics, networking and telecommunications equipment, and computer systems. The company is headquartered in San Jose, Calif., with sales offices, design centers, and research facilities around the world to serve the global electronics industry. More information about the company, its products, and services is available at www.cadence.com.

Cadence, Encounter and the Cadence logo are registered trademarks of Cadence Design Systems, Inc. in the United States and other countries. All other trademarks are the property of their respective owners.

Add to Digg Bookmark with del.icio.us Add to Newsvine

For more information, please contact:
Dean Solov
Cadence Design Systems, Inc.
408-944-7226

Email Contact 


Featured Video
Latest Blog Posts
Jobs
Sr. GIS Apps Product Engineer for ESRI at Portland, Oregon
Business Development Manager for Berntsen International, Inc. at Madison, Wisconsin
Geoprocessing Product Engineer II for ESRI at Redlands, California
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Mechanical Engineer 3 for Lam Research at Fremont, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Upcoming Events
GeoBuiz Summit 2025 at Hyatt Regency Aurora-Denver Conference Center. Denver CO - Jan 13 - 15, 2025
Coastal GeoTools 2025 Conference at 301 North Water Street - Jan 27 - 30, 2025
GEO Week 2025 at Colorado Convention Center Denver CO - Feb 10 - 12, 2025



© 2025 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise