congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini:
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congatec welcomes ratification of COM-HPC 1.2 specification, introducing COM-HPC Mini:

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Maximum performance for mini footprints

San Diego, CA, 10. October 2023 * * * congatec – a leading vendor of embedded and edge computing technology – welcomes PICMG’s ratification of the COM-HPC 1.2 specification, which introduces the COM-HPC Mini form factor. This new specification provides high-performance capabilities in a small form factor, measuring only 95 mm x 70 mm. Even devices with limited space can now benefit from the superior bandwidth and interface offerings of COM-HPC, including PCIe Gen 5 and Thunderbolt.

 

COM-HPC establishes itself as the most scalable Computer-on-Module (CoM) standard, covering a wide range of applications from small form factor designs to edge server designs. This simplifies the design-in process and enables the creation of complete product families with reduced engineering efforts. COM-HPC modules support not only specific processors like x86 or Arm but also FPGAs, ASICS, and AI accelerators, making it a comprehensive standard for developing innovative applications based on the latest embedded and edge data processing technologies.

 

Christian Eder, Chairman of PICMG's COM-HPC Working Group and Director of Market Intelligence at congatec, expresses his enthusiasm for the COM-HPC standard: “COM-HPC offers the highest performance, bandwidth, interfaces, and scalability compared to other computer-on-module standards and with COM-HPC Mini, engineers can now leverage all this on a real small form factor for space constrained embedded and edge computing designs.”

 

congatec is committed to supporting the adoption and implementation of the COM-HPC Mini specification, enabling customers to bring their solutions to market quickly. As a leading provider of embedded computing solutions, congatec also continues to develop and deliver products that align with the latest industry standards.

 

For more information about congatec and its COM-HPC ecosystem, please visit: https://www.congatec.com/en/ecosystems/com-hpc-ecosystem

 

The specification of congatec’s fist COM-HPC Mini module can be found here: https://www.congatec.com/en/technologies/com-hpc-mini/

 

The official PICMG COM-HPC page can be found here:

https://www.picmg.org/openstandards/com-hpc/

 

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About congatec  

congatec is a rapidly growing technology company focusing on embedded and edge computing products and services. The high-performance computer modules are used in a wide range of applications and devices in industrial automation, medical technology, robotics, telecommunications and many other verticals. Backed by controlling shareholder DBAG Fund VIII, a German midmarket fund focusing on growing industrial businesses, congatec has the financing and M&A experience to take advantage of these expanding market opportunities. congatec is the global market leader in the computer-on-modules segment with an excellent customer base from start-ups to international blue chip companies. More information is available on our website at www.congatec.com or via LinkedIn, X and YouTube.

 

 

Text and photograph available at: https://www.congatec.com/us/congatec/press-releases.html

 

 

 

 

Reader Enquiries:

congatec

Farhad Sharifi

Phone: 858-457-2600

Farhad.Sharifi@congatec.com

www.congatec.us

 

Press Contact:

congatec

Janene Rae

Phone: 858-457-2600

janene.rae@congatec.com

www.congatec.us

 

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