TE Connectivity Plans Innovative Pluggable Form Factor MSA for Increased Density and Improved Thermal Performance
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TE Connectivity Plans Innovative Pluggable Form Factor MSA for Increased Density and Improved Thermal Performance

HARRISBURG, Pennsylvania – February 13, 2015 – TE Connectivity (TE), a world leader in connectivity, announced today a plan to create a standard for a new 100Gb/s form factor pluggable interconnect with the functionality of QSFP28 in a thermally enhanced package approximately the size of the SFP form factor by way of a new MSA (multi source agreement) group. 

“Customers are looking for a smaller form factor that will offer increased faceplate density and higher aggregate bandwidth, while still maintaining superior thermal performance,” reports Nathan Tracy, technologist, TE Data Communications. “By defining a standard that provides significant thermal management improvements and increased density over existing form factors in both short and long reach applications, our MSA group will meet those customer needs.” 

“As the industry develops the next-generation datacenter equipment, there is value in an improved pluggable form factor that can support higher density designs and still meet high bandwidth requirements,” says Brad Booth, Principal Network Engineer of Microsoft’s Global Networking Services. “Thermal management becomes more of an issue as form factors get smaller, and this new MSA is an innovative step to address these design and power challenges.” 

In the coming months, the MSA will define the electrical connector, cage system and module dimensions that will establish this new form factor. TE is inviting connector manufacturers, optical module makers and communication equipment manufacturers to join the MSA and bring their areas of expertise to help ensure this system delivers on the goals of broad industry adoption and standardization. The new form factor will support direct-attach copper cables, active optical cables (AOCs) and transceivers with MPO and LC optical connections.

ABOUT TE CONNECTIVITY

TE Connectivity (NYSE: TEL) is a $14 billion global technology leader. Our connectivity and sensor solutions are essential in today’s increasingly connected world. We collaborate with engineers to transform their concepts into creations – redefining what’s possible using intelligent, efficient and high-performing TE products and solutions proven in harsh environments. Our 80,000 people, including 7,500 design engineers, partner with customers in over 150 countries across a wide range of industries. We believe EVERY CONNECTION COUNTS –  www.TE.com.


Contacts:

Nathan Tracy
TE Connectivity
717-986-7546
Email Contact
 
Lauren Brekosky
TE Connectivity
717-986-7342
Email Contact