Toshiba TK31E60W 4thgen DTMOS 600V Super-Junction MOSFET Reverse Costing Analysis
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Toshiba TK31E60W 4thgen DTMOS 600V Super-Junction MOSFET Reverse Costing Analysis

DUBLIN, November 20, 2013 — (PRNewswire) —

Research and Markets ( http://www.researchandmarkets.com/research/8dxmlg/toshiba_tk31e60w) have announced the addition of the "Toshiba TK31E60W 4thgen DTMOS 600V Super-Junction MOSFET Reverse Costing analysis" report to their offering.

     (Logo: http://photos.prnewswire.com/prnh/20130307/600769 )

The first Deep Trench Super-Junction MOSFET from Toshiba manufactured with a deep trench filling process 30% more efficient that the previous generation

The new generation Superjunction MOSFET from Toshiba has several new features.

First, the superjunction is not manufactured with a standard multi-epitaxy process but using a new deep trench filling process. This technique allows to narrow the pitch and results in a Rds(on) 30% lower. Moreover, the process simplification reduces the manufacturing cost by more than 20%.

Second, a trench gate replaces the traditional gate. The trench gate allows a greater reduction in the pitch and the Rds(on).

The DTMOS-4 MOSFET are targeted for power switching applications and offer a better power efficiency.

This report provides a reverse costing analysis of this power transistor with:

- Detailed photos & material analysis
- Manufacturing Process Flow
- In-depth economical analysis
- Manufacturing cost breakdown
- Selling price estimation

Key Topics Covered:

Executive Summary
Table of Contents
Reverse Costing Methodology

1. Physical Analysis
Physical Analysis Methodology
Package
Die Overview
Gate
Guard Ring
MOSFET Cell Super-Junction
MOSFET Cell
Polysilicon Gate Contact
Guard Ring
Back Side
MOSFET Structure
Deep Trench Super-Junction

2. Manufacturing Process
DTMOS Transistor Process Flow
Process Flow

3. Manufacturing Cost
Wafer Fabrication Unit
Yields Explanation
MOSFET Unprobed Wafer Cost
Wafer Cost per Process Steps
Equipment Cost per Family
Material Cost per Family
Probe Test
Dicing and Package
Final Test Cost
Component Manufacturing Cost
Yields Synthesis

4. Price Estimation
Contacts
Glossary

For more information visit  http://www.researchandmarkets.com/research/8dxmlg/toshiba_tk31e60w

Research and Markets
Laura Wood, Senior Manager.
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Research and Markets