Skyworks Introduces Industry’s First Multi-band, Multi-mode FDD/TDD Power Amplifier for 4G LTE Applications

WOBURN, Mass.—(BUSINESS WIRE)—December 16, 2008— Skyworks Solutions, Inc. (NASDAQ:SWKS), an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity, today introduced the industry’s first multi-mode and multi-band frequency division duplex (FDD)/time division duplex (TDD) power amplifier module (PAM) for fourth generation (4G) long term evolution (LTE) applications.

Skyworks’ PAM is also the first product available specifically targeting LTE-TDD bands 38 and 40. LTE TDD is expected to become the dominant 4G standard mobile operators utilize in China and other parts of the world. According to Strategy Analytics, the global LTE handset market is expected to reach 150 million units by 2013.

“Skyworks’ new multi-mode, multi-band LTE power amplifier enables enhanced talk, viewing and broadcast times, while complying with the stringent linearity requirements across wide frequency ranges,” said Dr. Gene A. Tkachenko, senior director of engineering responsible for LTE development at Skyworks. “With this latest product offering, we continue to demonstrate our leadership position in 4G and our commitment to providing innovative, cost-effective wireless solutions to our customers.”

About the SKY77441

The SKY77441 is a fully matched 16-pin surface mount module developed for LTE FDD (Band 7) and TDD (Bands 38 and 40) applications and covering the 2.3 to 2.7 gigahertz (GHz) range. It delivers over 26 decibels (dBm) of linear power output with full LTE resource block allocation under either quadrature phase-shift keying (QPSK), or 16 quadrature amplitude modulations (QAM), and over 28 dBm of linear output power under wideband code division multiple access (WCDMA) modulation. Small and efficient, the LTE FEM integrates the input and output matching networks, the power amplification stages, and the power detection in a single 4 x 4 x 0.85 millimeter (mm) package.

Integration of the PAM simplifies the design of the 4G-compatible handset radios and data cards, as all the active radio frequency (RF) circuitry is optimized within the single module component. Using Skyworks’ advanced indium gallium phosphide (InGaP) bipolar field effect transistor (BiFET) design and Skyworks GreenTM packaging solutions, the SKY77441 also supports low-operating voltage down to 3 volts (V) with high power added efficiency, high reliability and quality.

Pricing and Availability

Samples of the SKY77441 PA are currently available, with volume production scheduled to begin in 2009. For customized pricing, please contact Email Contact.

About Skyworks

Skyworks Solutions, Inc. is an innovator of high performance analog and mixed signal semiconductors enabling mobile connectivity. The company's power amplifiers, front-end modules and direct conversion radios are at the heart of many of today's leading-edge multimedia handsets. Leveraging core technologies, Skyworks also offers a diverse portfolio of linear products that support automotive, broadband, cellular infrastructure, industrial and medical applications.

Headquartered in Woburn, Mass., Skyworks is worldwide with engineering, manufacturing, sales and service facilities throughout Asia, Europe and North America. For more information, please visit Skyworks’ Web site at: www.skyworksinc.com.

Safe Harbor Statement

This news release includes "forward-looking statements" intended to qualify for the safe harbor from liability established by the Private Securities Litigation Reform Act of 1995. These forward-looking statements include information relating to future results and expectations of Skyworks (including certain projections and business trends). Forward-looking statements can often be identified by words such as "anticipates," "expects," "forecasts," "intends," "believes," "plans," "may," "will," "continue," similar expressions, and variations or negatives of these words. All such statements are subject to certain risks and uncertainties that could cause actual results to differ materially and adversely from those projected, and may affect our future operating results, financial position and cash flows.

These risks and uncertainties include, but are not limited to: unprecedented uncertainty regarding global economic and financial market conditions; the susceptibility of the wireless semiconductor industry and the markets addressed by our, and our customers', products to economic downturns; the timing, rescheduling or cancellation of significant customer orders and our ability, as well as the ability of our customers, to manage inventory; losses or curtailments of purchases or payments from key customers, or the timing of customer inventory adjustments; changes in laws, regulations and/or policies in the United States that could adversely affect financial markets and our ability to raise capital; our ability to develop, manufacture and market innovative products in a highly price competitive and rapidly changing technological environment; economic, social and political conditions in the countries in which we, our customers or our suppliers operate, including security and health risks, possible disruptions in transportation networks and fluctuations in foreign currency exchange rates; fluctuations in our manufacturing yields due to our complex and specialized manufacturing processes; delays or disruptions in production due to equipment maintenance, repairs and/or upgrades; our reliance on several key customers for a large percentage of our sales; fluctuations in the manufacturing yields of our third party semiconductor foundries and other problems or delays in the fabrication, assembly, testing or delivery of our products; the availability and pricing of third party semiconductor foundry, assembly and test capacity and raw materials; our ability to timely and accurately predict market requirements and evolving industry standards, and to identify opportunities in new markets; uncertainties of litigation, including potential disputes over intellectual property infringement and rights, as well as payments related to the licensing and/or sale of such rights; our ability to rapidly develop new products and avoid product obsolescence; our ability to retain, recruit and hire key executives, technical personnel and other employees in the positions and numbers, with the experience and capabilities, and at the compensation levels needed to implement our business and product plans; lengthy product development cycles that impact the timing of new product introductions; unfavorable changes in product mix; the quality of our products and any remediation costs; shorter than expected product life cycles; problems or delays that we may face in shifting our products to smaller geometry process technologies and in achieving higher levels of design integration; and our ability to continue to grow and maintain an intellectual property portfolio and obtain needed licenses from third parties, as well as other risks and uncertainties, including but not limited to those detailed from time to time in our filings with the Securities and Exchange Commission.

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