Menta Exhibits at Chiplet Summit and Presents Its New Scalable Chiplet Platform, MOSAICS-LP

SOPHIA ANTIPOLIS, France — (BUSINESS WIRE) — January 23, 2024Menta, a deeptech company specializing in semiconductor design will attend Chiplet Summit to present MOSAICS-LP – an industrial platform specifically designed for the development of heterogeneous chips, using a universal chassis and a catalog of third-party chiplets. This platform is supported by the French government and the CEA-List, a research center specializing in intelligent digital systems.

The Second Annual Chiplet Summit is a pivotal gathering for chip designers and market players, providing insights into optimizing chiplet performance in speed, scalability, power efficiency, and flexibility. The summit facilitates networking, expert interactions, and exposure to a wide array of products and services, enabling participants to stay abreast of the latest advancements in chiplet technology.

Menta, is a pioneer in programmable logic solutions and will share a booth with its partner CEA-List.

In the current semiconductor manufacturing environment, conventional monolithic solutions give rise to issues related to energy consumption, scalability, and cost. MOSAICS-LP aims to tackle these challenges, in the booming environment of heightened production demands. MOSAICS-LP addresses the Edge Computing market, including Artificial Intelligence, IoT, robotic, automotive industry and 5G/6G markets; by offering competitive, scalable, high-performance, and energy-efficient solutions.

Vincent Markus, CEO of Menta declares “At the forefront of innovation, Menta, alongside our strategic research partner CEA-List, is proud to participate in the Second Annual Chiplet Summit, a crucial event for chip designers and market players in the United States. MOSAICS-LP redefines semiconductor solutions, addressing issues of energy and cost in traditional monolithic approaches. Our groundbreaking platform, centered on Edge Computing and embedded AI, features a unique architecture with a universal chassis and chiplets. Key advantages include scalability, energy efficiency, reduced development costs, and risk mitigation through pre-tested components, making MOSAICS-LP an innovative solution for the evolving semiconductor landscape.”



Contact:

Press contacts
Yucatan Agency
Jean-Alexis Bourgier
jabourgier@yucatan.fr
Phone : +33 1 53 63 27 33

Featured Video
Jobs
Machine Learning Engineer 3D Geometry/ Multi-Modal for Autodesk at San Francisco, California
Senior Principal Mechanical Engineer for General Dynamics Mission Systems at Canonsburg, Pennsylvania
Principal Engineer for Autodesk at San Francisco, California
Manufacturing Test Engineer for Google at Prague, Czechia, Czech Republic
Mechanical Test Engineer, Platforms Infrastructure for Google at Mountain View, California
Senior Principal Software Engineer for Autodesk at San Francisco, California
Upcoming Events
Intergeo 2024 at Messe Stuttgart Messepiazza 1 Stuttgart Germany - Sep 24 - 26, 2024
GIS-Pro 2024 at Portland ME - Oct 7 - 10, 2024
Geo Sessions 2024 at United States - Oct 22 - 24, 2024



© 2024 Internet Business Systems, Inc.
670 Aberdeen Way, Milpitas, CA 95035
+1 (408) 882-6554 — Contact Us, or visit our other sites:
AECCafe - Architectural Design and Engineering EDACafe - Electronic Design Automation TechJobsCafe - Technical Jobs and Resumes  MCADCafe - Mechanical Design and Engineering ShareCG - Share Computer Graphic (CG) Animation, 3D Art and 3D Models
  Privacy PolicyAdvertise